MIS (Pre-Encapsulated Interconnect System)
All-round packaging technology

MIS all-round packaging technology,
Yes, when you marvel at the slim size and unparalleled high-density I / O that have not been seen before in MIS packaging, it is even more unexpected that MIS advanced pads are introduced to the design, creating even more cost reduction Most likely.
Extremely sharp, extremely efficient, and extremely economical-this is an epoch-making change brought by Changdian Technology's MIS patented technology to the packaging industry.

Original MIS packaging technology provides unparalleled product advantages
■ Ultra-small and thin size
■ High-quality RF electrical performance
■ BGA package density + QFN package technology
■ Flexible design choices
■ Superior market price competitiveness

Unprecedented technological expansion
■ Easy multi-turn and full-array external pin design
■ Chip I / O count from 2 to 500 in the same package form
■ Lead frame package gains BGA bumping ability for the first time
■ The inner fan-in design significantly shortens the wire length
■ Supports WB, FC and COL chip mounting, chip stacking, package stacking design
■ Flexible surface plating options (NiAu, NiPdAu, OSP)